电路物理层版图设计Microwind 3.5 with DSCH 3.5

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电路物理层版图设计Microwind 3.5 with DSCH 3.5
  • 软件作者: 网络搜集
  • 软件大小: 7.1 MB
  • 下载次数: | 所属栏目: 机电一体
  • 软件语言: 英文软件
  • 需要金币: 0 金币 金币充值金币
  • 软件评级: ★★★★★
  • 更新时间: 2015-08-21
  • 软件授权: 共享软件
  • 插件情况:
  • 运行环境: WinXP,Win7,Win8
Microwind 3.5真正的集成了EDA软件,涵盖了从概念到完成的IC设计,使芯片设计人员设计超出了他们的想象。MICROWIND集成了传统分离的前端和后端芯片设计为一体的综合流程,加快了设计周期,降低设计复杂性。
 
它将混合信号的实施紧密的集成在了一起,包括数字实施、电路模拟、晶体管级提取和验证等。提供了一个创新的教育计划,以帮助几乎每一个领域的个人发展集成电路产业。
 
Microwind 3.5 with DSCH 3.5的一些主要新功能:
 
基于软件许可节点被锁定,以缓解许可证管理,降低从事软件开发的安全成本。
 
支持Windows 2000/XP and Windows 7 (32/64 bit)等操作系统。
 
32纳米及45纳米工艺设计规则文件通过他们的应用笔记进行介绍。
 
对最小工艺/电压/温度值、典型值、最大模型值增加了一个新的屏幕。
 
面板底部增加了放大浏览器,这简化了在大型设计时的导航。
 
新增一个功能的命令 '3D View of the IC',这能够支持绘制布局的实时图像并填充3D表面,且提供出色的图像质量。
 
。。。

Microwind 3.5 with DSCH 3.5


 
What's new in version 3.5:
 
- Node locked software based licensing to ease your license management and reduce the security cost involved in software development. 
- Supports Windows 2000/XP and Windows 7 (32/64 bit). 
- Introduction of 32nm & 45nm technology design rule file with their application notes. 
- Added a new screen for process/Voltage/Temperature Min, Typ, max modes. 
- Zoom In Navigator added at bottom of the palette that eases the navigation in the case of very large designs. 
- A spectacular command '3D View of the IC' which enables to draw real-time images of the layout and navigate in fill-3D on the surface or inside the IC based on OpenGL and offers outstanding picture quality. 
- Metallization macros which ease the addition of contacts in the layout have been updated to handle up to 8 layers of metal especially for 45nm technology. 
- Totally new companion software tutorial 'silicon' to give a user's controlled 3D view of silicon atoms such as SiO2 and carbon nanotubes. 
- Improved Global Delay Evaluation at integrated circuit level. 
- Enhanced Global Crosstalk evaluation effect based on analytical approximations of the coupling amplitude. 
- Improved and new Help on Design Rules. 
- Improve drawing speed (specifically pads) with very large screen resolution. 
- Improved 3D views for 65, 45 and 32nm technologies based on Intel/Ibm technologies. 
- Improved Microwind/Dsch 3.5 manual including some new features (Ion/Ioff, PVT variations) 
- DSCH : Added a tool on fault analysis at the gate level of digital. Faults: Stuck-1, stuck-at-0. The technique allows injection of single stuck-at fault at the nodes of the circuit. 
- DSCH : Improved interface between DSCH and Winspice. 
..many more improvements in software function & operation.
标签:Microwind 3.5
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